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Modelo: Energy Storage System-Rigid Copper Busbar
Marca: htd
Origin: PORCELANA
Lugar de origen: PORCELANA
Posicionamiento del producto:
La barra colectora del lado de CC HTD PCS es un componente conductor crítico diseñado para sistemas de conversión de energía (PCS) de almacenamiento de energía. Diseñada para garantizar una transferencia de energía eficiente entre el grupo de baterías y el lado de CC del convertidor, esta barra colectora utiliza cobre T2 de alta conductividad (pureza ≥99,9 %) o una estructura compuesta avanzada de cobre y aluminio. Su diseño laminado multicapa y tecnología de aislamiento integrada ofrecen conexiones de baja impedancia y transmisión de corriente estable. Clasificado para un funcionamiento confiable de -40 °C a 105 °C, presenta una inductancia parásita ultrabaja de ≤15 nH y mantiene un aumento de temperatura de ≤35 K bajo la corriente nominal. Al mejorar la distribución de corriente y reducir la pérdida de energía, la barra colectora compacta mejora la utilización del espacio del gabinete PCS en más de un 20%.
Parámetros clave de rendimiento de la barra colectora de cobre :
| Category | Specific Parameters | Test Standard |
| Base Material Type | T2 Copper (default), Copper-Aluminum Composite Structure (optional) | GB/T 5585.1 |
| Electrical Conductivity | DC resistivity ≤0.026 Ω·mm²/m; carries 85%-90% current of equivalent solid copper busbar | IEC 60287 |
| Rated Current |
Continuous current: 300A–6000A (section optimized); peak current ≥3x rated value |
IEC 60947 |
| Insulation & Protection | Withstand voltage ≥3500V AC (60s); protection class IP67; creepage distance ≥10mm | ISO 20653 |
| Mechanical Strength | Tensile strength ≥220 MPa; vibration stability ≥20g (10–2000Hz) | IEC 60068-2-6 |
| Thermal Management |
Operating Temperature: -40°C~105°C, Short-term Withstand: 180°C | IEC 60068-2-14 |
| Connection Reliability |
Contact Resistance ≤5μΩ, Bolt Torque Retention Rate ≥95% (post-vibration) | Enterprise Standard |
| Step | Core Process | Key Technical Points | Output Standard |
| 1 | Material Composite | T2 copper strip slitting, online bright annealing | Conductivity ≥100% IACS |
| 2 | Precision Stamping | Progressive die high-speed stamping, burr control | Dimensional tolerance ±0.1mm |
| 3 | Bending & Forming | Servo-controlled bending, arc precision control | Bend radius accuracy ±0.1mm |
| 4 | Surface Treatment | Selective silver/tin plating, micro-arc oxidation | Plating thickness 5–15μm |
| 5 | Insulation Integration | Electrostatic spraying of epoxy powder or insert molding | Insulation withstand voltage ≥3500V AC |
| 6 | Comprehensive Testing |
Loop resistance, partial discharge, vibration |
Defect rate ≤0.01% |
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